| PART |
Description |
Maker |
| 349-10-104-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-102-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-106-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 0901210765 90121-0765 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, 5 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90627-0761 0906270761 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, with Kinked PC Tail
2.54mm (.100") Pitch C-Grid III垄芒 Header, Single Row, Vertical, with Kinked PC Tail
|
Molex Electronics Ltd.
|
| 829-22-016-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount SIngle Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-010-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-008-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 0901200140 90120-0140 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
|
